Content：
ArChine Soldertech 68HB
Solder Assist Fluid
Product Description
ArChine Soldertech 68HB is a medium viscosity, polyalkylene glycol with excellent thermal stability and water washability. It is designed for use in solder reflow fluids, fluxes, fusing fluids, and other process fluids where high temperature stability and water solubility are critical. ArChine Soldertech 68HB does not contain any water insoluble additives which could be deposited on the circuit board during aqueous cleaning procedures.
Product Features
Good Thermal Stability
High Flash Point
Excellent Water Washability
Low Foam Tendency
Biodegradable, Low Toxicity
Low Odor
High Product Clarity
ArChine Soldertech 68HB has been found particularly useful in fusing and reflow fluids and fluxes. They are used in fusing fluxes to help transform the Sn-Pb electroplate into solder-coat during fabrication and in reflow fluids to “reflow” solder-coat and solder perform in assembly operations. In these products the ArChine Soldertech 68HB serves to evenly distribute the activators over the surfaces to be soldered and to protect the hot solder from oxidation during heating. ArChine Soldertech 68HB is also used as hot liquid leveling fluids to smooth solder coatings and clear plated through-holes, and as blanketing fluids to reduce dross formation on the liquid solder.
Typical Physical Properties (1)
| Appearance | Colorless clear liquid |
| Density, 20℃, g/cm3 | 1.035 |
| Kinematic Viscosity@40℃, mm2/s | 68.75 |
| Kinematic Viscosity@100℃, mm2/s | 14.0 |
| Viscosity Index | 213 |
| Flash Point, Open Cup, ℃ | 248 |
| Fire Point, ℃ | 260 |
| Pour Point, ℃ | -48 |
| Copper Corrosion, 100℃, 3h | 1 |
(1) The physical property data listed are considered to be typical properties, not specifications.
(2) Product contains small amounts of water-insoluble additives which are present to improve thermal stability.
