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ArChine Arcfluid SF 280
Solder Assist Fluid
Product description
ArChine Arcfluid SF 280 is a water soluble polyalkylene glycol-based fluid formulated with an additive package to improve the product’s stability at high temperatures and to raise its flash point. It is designed for use as a component in solder reflow fluids, fluxes, fusing fluids, and other process fluids where high temperature stability and good water wash ability are critical.
Product features
- Good Thermal Stability
- High Flash Point
- Excellent Water Washability
- Low Foam Tendency
- Low Odor
- High Product Clarity
ArChine Arcfluid SF 280 has been found particularly useful in various heat transfer and blanketing applications. It is used as a heat transfer media to fuse Sn-Pb electroplate into solder-coat during fabrication and to “reflow” solder-coat and solder perform during assembly. As a flux component, ArChine Arcfluid SF 280 aids in heat transfer and protects the solder from oxidizing. It is also used as a hot liquid leveling fluid to smooth colder coatings and clear plated through-holes, and as a blanketing fluid to reduce dross formation on the liquid solder.
Typical physical properties
| Property | ArChine Arcfluid SF 280 |
| Viscosity, cSt at 40℃ | 280 |
| Specific Gravity, 20/20℃ | 1.088 |
| Density, lbs/gal, 68°F (g/cc, 20℃) | 9.06 (1.086) |
| Pour Point, ℉(℃) | 5 (-15) |
| Flash Point | |
| Closed cup, ℉ (℃) | 350 (177) |
| Open cup, ℉(℃) 605 (318) | 605 (318) |
| Surface Tension, dynes/cm | 38.7 |
| Water Solubility, 25℃ | Complete (1) |
| Cloud Point, ℉ (℃)(2) | 185 (85) |
(1) Product contains small amounts of water-insoluble additives which are present to improve thermal stability.
(2) Temperature above which a 1% aqueous solution of the product separates.
